- Price
- $4.15
- Day
- +10.96%
- Mkt Cap
- $769.00M
- 52W Range
- $1.68 – $6.61
- Volume
- 4.91M
- Beta
- 3.55
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Massively parallel architecture enables sub-picojoule-per-bit efficiency — a fraction of the energy consumed by conventional interconnects, with direct implications for data center power and cooling costs The paper details how MicroLED optical links offer a roadmap to 20 Tb/s — scaling by channel count rather than lane speed as copper and laser-based optics approach physical limits NEW YORK, NY, Aug. 03, 2026 (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC), a fabless semiconductor company, and Kopin Corporation (Nasdaq: KOPN), a leading developer of microdisplay and MicroLED technology — joint developers of the Neural I/o™ MicroLED-based optical interconnect technology — today announced the publication of a jointly authored white paper, "Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure," examining why data movement — not compute — has become the primary constraint on AI infrastructure, and how MicroLED optical interconnects address it. The publication follows the companies' ongoing collaboration to commercialize Neural I/o™, a MicroLED-based optical interconnect platform designed to address the growing bandwidth and energy demands of next-generation AI infrastructure.
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Kopin Corporation earns a Buy rating as it pivots from defense to AI-driven data center optical interconnects, targeting rapid revenue expansion. KOPN's collaboration with Fabric AI positions it as the sole supplier of Neural I/O chipsets, with projected segment revenues doubling total company sales within two years. MicroLED technology offers hyperscalers compelling energy and cost savings, addressing critical OPEX challenges as data center energy costs rise.
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